BOULDER, CO (July 28, 2026) |
ParaScript, an Al-powered document processing company, today announced it has been named Embedded Tech Partner of the Year by Tungsten Automation, a provider of intelligent workflow automation solutions. The recognition reflects 14 years of collaboration between the companies and comes as they extend their partnership to further advance fraud detection and document automation capabilities for financial institutions.
The Embedded Technology Partner of the Year designation recognizes ParaScript's performance across three key areas: accuracy, throughput and integration depth. ParaScript's handwriting recognition, signature validation and check fraud detection technologies have been embedded within Tungsten Automation's FraudOne check fraud detection platform, helping financial institutions improve processing accuracy and reduce fraud exposure. Together, the companies support more than 500 shared financial institution customers and have helped prevent an estimated $4.2 billion in fraud losses.
Beyond fraud detection, ParaScript's technology supports document-intensive workflows across the Tungsten ecosystem. By combining Tungsten's automation capabilities with ParaScript's AI - powered recognition technology, customers benefit from reduced manual review, faster decisioning and improved straight-through processing.
As part of the partnership extension, the companies are advancing a shared roadmap focused on expanded detection of altered and counterfeit check fraud, deeper integration with Tungsten's intelligent automation platform and enhanced analytics to help financial institutions better identify and monitor fraud trends across their portfolios. These initiatives come as financial institutions face increasing pressure from document fraud, growing document complexity and evolving customer expectations. As AI continues to reshape the intelligent document processing (IDP) landscape, organizations are seeking proven solutions capable of addressing increasingly sophisticated fraud threats and automation demands.
“We are honored to be recognized as Tungsten Automation's Embedded Technology Partner of the Year,” said Emiliano Giacchetti, CEO of ParaScript. “As fraud schemes become more sophisticated and operational demands continue to grow, financial institutions need technology partners that can help them stay ahead of emerging threats. We look forward to expanding our work with Tungsten to deliver even greater fraud prevention, automation and intelligence for our shared customers.”